Shaped solder pad for surface mounting electronic devices...

Details Shaped solder pad for surface mounting electronic devices... Shaped solder pad for surface mounting electronic devices...

H - Electricity

05

K

356/8

H05K 13/04 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1219963

A SHAPED SOLDER PAD FOR SURFACE MOUNTING ELECTRONIC DEVICES AND A SURFACE MOUNTING POSITION INCORPORATING SUCH SHAPED PADS Abstract of the Disclosure Solder pads for surface mounting of devices on a circuit board are given predetermined shapes. By shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on melting of the solder at the pad. Improved alignment and positioning is obtained. Broadly, a contact or solder pad comprises a rectangular portion and a segmental portion, the device end resting on the rectangular portion and the segmental portion being outside of the contact position. - i -

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