C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 7/02 (2006.01) C09J 5/00 (2006.01) C09J 7/00 (2006.01) C09J 11/00 (2006.01) C09J 133/04 (2006.01) C09J 163/00 (2006.01) C09J 171/02 (2006.01)
Patent
CA 2205750
A sheet-form, curable pressure-sensitive adhesive is disclosed which includes a high molecular weight polymer (A) such as an acrylic polymer for constituting a pressure-sensitive adhesive component, a compound (B) containing an epoxy group, and a polymerization initiator (C) which is activated upon application of an activation energy such as a light to cause the compound (B) having an epoxy group to undergo a ring-opening polymerization.
Adhésif sensible à la pression remédiable en forme de feuille constitué d'un polymère à poids moléculaire élevé (A) comme un polymère acrylique, servant à fabriquer un composant adhésif sensible à la pression, d'un composé (B) contenant un époxyde, ainsi qu'un initiateur de polymérisation (C) activé par une source d'énergie comme la lumière, afin de permettre au composé (B) contenant de l'époxyde de subir une polymérisation à chaîne ouverte.
Fukui Hiroji
Nakasuga Akira
G. Ronald Bell & Associates
Sekisui Kagaku Kogyo Kabushiki Kaisha
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