Sheet molding compound

C - Chemistry – Metallurgy – 08 – K

Patent

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400/4302

C08K 5/29 (2006.01) C08G 18/67 (2006.01) C08G 18/68 (2006.01) C08K 7/14 (2006.01) C08L 67/06 (2006.01)

Patent

CA 1132743

(H) ABSTRACT OF THE DISCLOSURE Sheet molding compound is prepared from unsaturated polyester resin syrup, particulate fillers, randomly oriented reinforcing fibers, a polyhydroxy polyacrylate or polyhydxoxy polymethacrylate and an organic polyisocyanate. At the time of manufacturing the sheet molding compound, the organic diisocyanate combines with the polyhydroxy polyacrylate or polyhydroxy polymethacrylate to thicken the sheet molding compound without causing polymerization of the unsaturated polyester resin syrup.

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