Shielding mechanism for circuit substrate

H - Electricity – 05 – K

Patent

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Details

H05K 1/02 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2192903

A casing body contains a print substrate. A circuit block is surrounded by an earth pattern on the surface of the print substrate. A shield space is formed within the casing body by contacting a shield wall formed on the cover with the earth pattern when the opening of the casing body is closed by the cover. When closing the cover, a guide mechanism positions the shield wall with respect to the earth pattern which is fixed to the casing body. The shield wall is therefore reliably contacted with the earth pattern.

L'invention est constituée d'un boîtier contenant un substrat d'impression. Un circuit est entouré d'une configuration de mise à la terre sur la surface du substrat d'impression. Un espace de blindage est créé à l'intérieur du boîtier par un contact établi entre une paroi de blindage formée sur le couvercle d'une part et la configuration de mise à la terre d'autre part quand l'ouverture du boîtier se trouve fermée par le couvercle. Quand on ferme le couvercle, un mécanisme de guidage positionne la paroi de blindage par rapport à la configuration de mise à la terre fixée au boîtier. La paroi de blindage est alors mise en contact de façon sûre avec la configuration de mise à la terre.

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