Sic thin-film thermistor

H - Electricity – 01 – C

Patent

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Details

H01C 7/18 (2006.01) H01C 1/14 (2006.01) H01C 17/12 (2006.01)

Patent

CA 2047639

A thin-film thermistor element comprises an electrically insulating substrate having first and second surfaces opposite each other and a pair of through-holes therein extending completely through its thickness, and a pair of electrode films each including a body portion of a large surface area and a generally comb-shaped portion extending outwardly from the body portion. The electrode films are formed by a firing process on the first surface of the substrate with their respective comb-shaped portions confronting each other. First and second electroconductive films are also formed on respective surrounding wall faces defining the holes in the substrate in electrically connected relationship with the body portions of the associated electrode films. A temperature sensitive resistance film is formed by a high frequency sputtering process on the first surface of the substrate to overlie the electrode films.

Ÿlément thermistance à couche mince comportant un substrat isolant et ayant une première et une seconde surfaces opposées, une paire de trous qui en traversent toute l'épaisseur, et une paire de films-électrodes, chacun comportant un corps couvrant une grande surface et une section généralement en peigne prolongeant le corps. Les films-électrodes sont produits par un processus de cuisson de la première surface du substrat avec leurs sections en peigne respectives opposées. Un premier et un second films électro-conducteurs sont également produits sur les surfaces avoisinantes respectives des trous traversant le substrat, dans une liaison électrique avec les corps des films-électrodes associés. Un film-résistance thermosensible est produit au moyen d'un processus de pulvérisation haute fréquence sur la première surface du substrat pour recouvrir les films-électrodes.

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