C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/196, 260/298
C08L 79/08 (2006.01) C07F 7/18 (2006.01) C08K 5/544 (2006.01)
Patent
CA 1283414
ABSTRACT OF THE DISCLOSURE An adhesion promoter for polyimide is provided having the formula: Image wherein A is Image or Image Ar is an aromatic group, R1 is lower alkyl, R11 is OR1 or lower alkyl, R111 is hydrogen or lower alkyl.
526366
Park Chan E.
Rajendran Giovindasamy P.
Tesoro Giuliana
Uhlmann Donald R.
Massachusetts Institute Of Technology
Riches Mckenzie & Herbert Llp
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