Silicon-containing sputtering target

C - Chemistry – Metallurgy – 23 – C

Patent

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117/225, 204/167

C23C 14/34 (2006.01) C03C 17/245 (2006.01) C03C 17/25 (2006.01) C03C 17/34 (2006.01)

Patent

CA 1341514

A sputtering target is composed essentially of a substance containing from 1 to 90 atomic % of Zr, from 3 to 95 atomic % of Si and from zero to 67 atomic % of O. Alternatively, boron may be present such that there is from 1 to 90 atomic % of Zr, from 3 to 95 atomic % of B + Si and from zero to 67 atomic % of O, provided that when 9Zr < B, B < 0.25Si + 9Zr.

617133

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