Silicon platform for optical modules

Details Silicon platform for optical modules Silicon platform for optical modules

H - Electricity

01

L

H01L 23/485 (2006.01) G02B 6/12 (2006.01) G02B 6/42 (2006.01) H01L 23/66 (2006.01)

Patent

CA 2331970

A small-sized and low-cost silicon platform for optical modules which enables high-speed transmission. A conductor pattern is formed on an oxide layer formed on the surface of a silicon substrate through a dielectric film. A hole extending from the surface of the dielectric film to the oxide layer is formed in the dielectric film at a position for the formation of a bonding pad. A conductor material is directly formed on the oxide layer exposed to the bottom of this hole. This conductor material constitutes a bonding pad portion electrically connected to the conductor pattern.

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