H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 27/00 (2006.01) H01L 23/473 (2006.01)
Patent
CA 2444411
This invention 'Silicon Slab and Block' enables very large scale integration of electronics and optics with the size of large electronics and Optical equipments such as telecom petabit routers or switches, super computers, control systems, space and air born electronic equipments being reduced drastically. The Silicon Slab consists of several Very Large Scale Silicon and or GaAs Electrical and or Optical Integrated Circuits, placed in a rectangular slab of silicon or a polymer or other suitable material, with very fine pitch electrical and or optical connectivity between the ICs. The ICs are rectangular and have electrical metal contact studs and or optical apertures with very fine pitch on five sides of the ICs as needed and feasible. Individual Silicon Slabs may be soldered to a PCB and cooled by conventional means. Several of these Slabs are mounted side- by-side, connected together by a 'Backplane Slab', and mounted in a Mounting and Cooling Block to form a Silicon Block. The Slabs are liquid cooled with coolant flowing through a plate with cooling cavity in contact with the slabs. The Backplane Slab has electrical and optical connectivity between the Silicon Slabs and to the outside world such as power, clock, inter chassis connections etc. A Front Plate with electrical wires and or optical fibers connects the Slab to the outside world such as line interface etc. Fine pitch of electrical and optical connectivity with liquid cooling results in very high integration in a compact volume.
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