Silicon wafer polishing

Details Silicon wafer polishing Silicon wafer polishing

C - Chemistry, Metallurgy

30

B

149/24

C30B 35/00 (2006.01) C09G 1/02 (2006.01) H01L 21/306 (2006.01) H01L 29/04 (2006.01)

Patent

CA 1071511

SILICON WAFER POLISHING Abstract of the Disclosure The polishing of monocrystalline silicon wafers with an aqueous composition of fine sized abrasive particles, a soluble alkali metal base such as sodium carbonate and an oxidizing agent such as sodium or potassium salt of dichloroiso- cyanuric acid (e.g. salts of halo-trizenetrione).

267072

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