Silicone composition and thermally conductive cured silicone...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 83/07 (2006.01) C08K 3/22 (2006.01) C08L 71/00 (2006.01) C08L 83/04 (2006.01) C08L 83/05 (2006.01) C08L 71/02 (2006.01) C08L 83/12 (2006.01)

Patent

CA 2439603

A silicone composition for preparing a cured silicone product, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an alumina filler in a concentration sufficient to impart thermal conductivity to the cured silicone product; (D) an effective amount of a polyether; and (E) a catalytic amount of a hydrosilylation catalyst. A cured silicone product comprising a reaction product of the silicone composition.

L'invention concerne une composition de silicone élaborée pour préparer un produit en silicone réticulé. Cette composition renferme (A) un organopolysiloxane contenant une moyenne d'au moins deux groupes d'alcényle liés à la silicone par molécule, (B) un organohydrogénopolysiloxane contenant une moyenne d'au moins deux atomes d'hydrogène liés à la silicone par molécule dans une concentration suffisante pour réticuler la composition, (C) une charge d'alumine dans une concentration suffisante pour faire du produit en silicone réticulé un conducteur thermique, (D) une quantité efficace d'un polyéther, et (E) un quantité catalytique d'un catalyseur d'hydrosilylation. Cette invention concerne également un produit en silicone réticulé contenant un produit de réaction de la composition de silicone.

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