Silicone encapsulated devices

Details Silicone encapsulated devices Silicone encapsulated devices

H - Electricity

01

L

356/170, 117/187

H01L 23/29 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1331116

- 8 - SILICONE ENCAPSULATED DEVICES Abstract The addition of a low viscosity (2-100 centipoise) polysiloxane such as a polydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices. (NO FIGS.)

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