Silicone molding compounds of improved crack resistance

Details Silicone molding compounds of improved crack resistance Silicone molding compounds of improved crack resistance

C - Chemistry, Metallurgy

08

L

400/4028, 400/51

C08L 83/06 (2006.01) C04B 26/32 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1118928

ABSTRACT OF THE DISCLOSURE The crack resistance of phenyl silicone molding compounds containing siliceous fillers is improved by incorporating therein from 4 to 15 percent by weight based on the combined weight of the resins of an aromatic epoxy resin having an epoxide equivalent of from 475 to 2000. These molding compounds are particularly suitable for encapsulating electronic devices such as diodes.

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