C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 183/08 (2006.01) C09J 183/07 (2006.01)
Patent
CA 2080775
SILICONE PRESSURE SENSITIVE ADHESIVES HAVING ENHANCED ADHESION TO LOW ENERGY SUBSTRATES ABSTRACT There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorgano- siloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as poly- ethylene and polytetrafluoroethylene.
Brady William Patrick
Chung Kyuha
Schmidt Randall Gene
Vincent Gary Allen
Brady William Patrick
Chung Kyuha
Dow Corning Corporation
Gowling Lafleur Henderson Llp
Schmidt Randall Gene
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