C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/07 (2006.01) C08L 83/04 (2006.01)
Patent
CA 2348176
A silicone rubber composition for extrusion molding applications having a high cure rate and providing silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to limited extent. The silicone rubber composition includes (A) 100 weight parts of a silicone rubber base compound containing (a-1) a diorganopolysiloxane gum, (a-2) reinforcing silica, and (a-3)a silanol-endblocked organosiloxane oligomer or hexaorganodisilazane; and (B) 0.1 to 10 weight parts of an organoperoxide with the formula R - COOOCOO - R1 - OOCOOOC - R where R is an alkyl group, an alkoxy group, the group -SiR2 3, the group -CH2SiR2 3, or the group -Ph-R3c where R2 is an alkyl or alkoxy group, Ph is phenylene, R3 is an alkyl group, an alkoxy group, the group -SiR2 3, or the group -CH2SiR2 3; c is 0 to 3, and R1 is a C1 to C10 alkylene group.
Baba Katsuya
Hirai Kazuo
Honma Hiroshi
Bereskin & Parr
Dow Corning Toray Silicone Company Ltd.
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