Silver compositions

Details Silver compositions Silver compositions

H - Electricity

01

B

31/107, 117/225

H01B 1/02 (2006.01) H01B 1/16 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1050746

Abstract of the Disclosure Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising metal powder and 1-5% glass-free inorganic binder. The binder consists essentially of certain amounts of bismuth oxide and oxides of copper and/or lead, and optionally MnB2 and/or MnO2. The metal powder is either silver or a mixture of silver with a second metal powder; the second metal powder is Pt, Pd, Au, or an alloy of Cu with one or more of Pt, Pd, Au, and Ag. The weight ration of Ag to other metals is at least 17/1. These compositions are useful for making conductor patterns on substrates, which patterns have good adhesion to the substrate, both initially and after thermal aging (e.g., 150°C. for 48 hours). - 1 -

227572

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