Simultaneous offset dual sided laser shock peening using low...

Details Simultaneous offset dual sided laser shock peening using low... Simultaneous offset dual sided laser shock peening using low...

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) B24C 1/10 (2006.01) C21D 10/00 (2006.01) F01D 5/28 (2006.01)

Patent

CA 2398339

A method for laser shock peening (LSP) an article (108) by simultaneously firing low energy first and second laser beams (102, 103) to form pairs of longitudinally spaced apart (LD) first and second laser shock peened spots (158, 159) that are on opposite sides of the article (108), simultaneously laser shock peened, and transversely offset (OS) from each other. Each of the low energy first and second laser beams (102, 103) having a level of energy of between 1-10 joules.

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