Simultaneous vertical-seismic profiling and surface seismic...

Details Simultaneous vertical-seismic profiling and surface seismic... Simultaneous vertical-seismic profiling and surface seismic...

G - Physics

01

V

349/4, 349/9

G01V 1/00 (2006.01)

Patent

CA 1293045

ABSTRACT OF THE DISCLOSURE An inventive method for simultaneously collecting depth-of-focus vertical seismic profiling (VSP) data and three-dimensional surface seismic data is disclosed. At least one seismic sensor is deployed at a predetermined depth of a borehole and raised in increments determined by the survey. A seismic source and a plurality of seismic sensors may be deployed at the surface along a partial arc offset from the top of the borehole by a distance inversely proportional to the depth of the sensor in the borehole. The seismic source generates a seismic signal at a plurality of points in a circular path around the borehole. Once a circle has been completed, the borehole sensor is raised, and the seismic signal generator and sensors are moved to the next largest circular path and the process is repeated. The seismic signals are simultaneously recorded by the borehole sensor and the sensors deployed in the arcuate path. The object is to overlap areal VSP coverage with surface seismic coverage to reduce the number of variables which influence correlation of the two data sets.

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