Single or multi-layer printed circuit board with improved...

H - Electricity – 05 – K

Patent

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Details

H05K 3/46 (2006.01) H05K 3/44 (2006.01)

Patent

CA 2586290

A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

Selon l~invention, une carte de circuit ou chaque carte de circuit d~une carte de circuit multicouche comprend une feuille conductrice électriquement revêtue d~une couche supérieure isolante recouvrant une surface de la feuille conductrice, une couche inférieure isolante recouvrant une autre surface de la feuille conductrice et une couche de bord isolante recouvrant un bord de la feuille conductrice. Une couche intercalaire isolante peut être prise en sandwich entre une paire de cartes de circuit adjacentes d~un assemblage de cartes de circuit multicouches. Un trou de passage sans pastille ou un trou d~interconnexion peut se prolonger à travers une ou plusieurs des cartes de circuit pour connecter des conducteurs électriques sur des surfaces opposées de celles-ci.

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