Sintered diamond having high thermal conductivity and method...

C - Chemistry – Metallurgy – 22 – C

Patent

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Details

C22C 26/00 (2006.01) C04B 35/645 (2006.01) C22C 1/05 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2462451

This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.

L'invention concerne un corps fritté présentant une conductivité thermique élevée comprenant, principalement, du diamant et présentant d'excellentes caractéristiques en tant que puits thermique pour un élément électronique, par exemple, un laser à semi-conducteur ou un microprocesseur haute performance. La présente invention concerne également un procédé permettant de fabriquer ce diamant et un puits thermique utilisant ce corps fritté. Cette invention concerne plus particulièrement un puits thermique adapté au montage d'un élément semi-conducteur de grande taille présentant une charge thermique élevée, par exemple, un laser à semi-conducteur à haut débit ou un microprocesseur haute performance, lequel puits thermique permet d'obtenir une dilatation thermique correspondant à une conductivité thermique élevée. Les caractéristiques de conductivité thermique et de dilatation thermique pouvant être régulées de manière relativement libre, on peut choisir un puits thermique optimal qui correspond aux attributs et à la conception de l'élément monté.

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