Slicing of single-crystal films using ion implantation

C - Chemistry – Metallurgy – 30 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C30B 33/00 (2006.01) C30B 29/60 (2006.01) C30B 31/22 (2006.01)

Patent

CA 2365992

A method is provided for detaching a single-crystal film from an epilayer/substrate or bulk crystal structure. The method includes the steps of implanting ions into the crystal structure to form a damage layer within the crystal structure at an implantation depth below a top surface of the crystal structure, and chemically etching the damage layer to effect detachment of the single-crystal film from the crystal structure. The thin film may be detached by subjecting the crystal structure with the ion implanted damage layer to a rapid temperature increase without chemical etching. The method of the present invention is especially useful for detaching single-crystal metal oxide films from metal oxide crystal structures. Methods for enhancing the crystal slicing etch-rate are also disclosed.

L'invention concerne un procédé permettant de détacher une couche monocristalline d'une couche épitaxiale/substrat ou d'une structure cristalline non épitaxiée. Ce procédé consiste à implanter des ions dans la structure cristalline afin de former une couche endommagée à une profondeur d'implantation située en dessous d'une surface supérieure de la structure cristalline, puis à attaquer chimiquement cette couche endommagée, afin d'exécuter le détachement du film monocristallin à partir de la structure cristalline. Pour détacher le film mince, on peut soumettre la structure cristalline comprenant la couche endommagée à ions implantés à une rapide augmentation de température sans attaque chimique. Le procédé selon l'invention est notamment utile pour détacher des films d'oxydes métalliques monocristallins à partir de structures cristallines d'oxydes métalliques. L'invention concerne également des procédés permettant d'améliorer le taux d'attaque de la coupe en tranche du cristal.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Slicing of single-crystal films using ion implantation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slicing of single-crystal films using ion implantation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slicing of single-crystal films using ion implantation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1590583

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.