Slip ring with integral bearing assembly and method of...

H - Electricity – 01 – R

Patent

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Details

H01R 39/08 (2006.01) H01R 43/10 (2006.01)

Patent

CA 2279115

These and other objects of the present invention are achieved by inserting electrically conductive rings and a bearing into a mold before a slip ring body is injection molded. During the injection molding process, the rings and the bearing are partially encapsulated by the injected plastic and retained. Plastic is prevented from entering the race of the bearing by using a pair of additional plastic inserts which prevent plastic from entering the bearing race. When the injected plastic cools, the plastic shrinks and compresses the bearing thereby preventing axial movement. Wires attached to the rings are also encapsulated by the plastic material during the injection molding process.

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