H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/132
H01L 23/24 (2006.01) H01L 23/367 (2006.01) H01L 23/467 (2006.01)
Patent
CA 1140681
Slotted Heat Sinks For High Powered Air Cooled Modules Abstract An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat con- ductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater sur- face area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling. FI9-79-030
360338
Leaycraft Edgar C.
Oktay Sevgin
Ostergren Carl D.
International Business Machines Corporation
Saunders Raymond H.
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