Smart card body, smart card and manufacturing process for same

Details Smart card body, smart card and manufacturing process for same Smart card body, smart card and manufacturing process for same

G - Physics

06

K

G06K 19/077 (2006.01)

Patent

CA 2568123

The present invention relates to a smart card body, a smart card and a manufacturing process for same, and in particular to smart cards used for subscriber identity modules (SIM) cards. To improve a process for the manufacture of a smart card body and a process for the assembly of a smart card in such a manner that a simple and adaptable process can be achieved for the manufacture of a smart card, a process for the manufacture of a smart card body (10) for incorporating a semiconductor chip is described, wherein the process comprises the formation of a lead frame in a conductive layer (1), wherein the lead frame has first contacts (2) on a first surface and can be connected to the semiconductor chip on a second surface opposite the first surface, and the formation of a electrically insulating casing layer (11) on the second surface of the smart card body, wherein the casing layer (11) has a recess (12) for incorporating the semiconductor chip.

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