Smart card chip coated with a layer of insulating material,...

Details Smart card chip coated with a layer of insulating material,... Smart card chip coated with a layer of insulating material,...

H - Electricity

01

L

H01L 23/48 (2006.01) G06K 19/077 (2006.01) H01L 23/31 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2220636

A smart card chip including a semiconductor chip (4) with an operative side provided with contact pads (5) and projections (6) of varying heights. The operative side of the chip (4) is at least partially coated with a layer of insulating material (7) that is at least as thick as the height of the tallest projection (6), said layer being shaped in such a way that the contact pads (5) are freely accessible, and having an outer surface parallel to the periphery (12) of the operative side of the chip (4). Said layer (7) enables the chip to be mounted in a card body while remaining perfectly parallel thereto, this being necessary to enable conductive pattern screen printing at a later stage.

La puce pour carte électronique selon l'invention comprend une microplaquette de semi-conducteur (4) ayant une face active pourvue de plots de contact (5) et sur laquelle sont formées des aspérités (6) de différentes hauteurs. Elle se caractérise en ce que la face active de la microplaquette (4) est revêtue au moins partiellement d'une couche de matière isolante (7) ayant une épaisseur supérieure ou égale à la hauteur de l'aspérité (6) la plus haute, cette couche étant conformée pour autoriser un libre accès aux plots de contact (5) et ayant une face externe parallèle à la périphérie (12) de la face active de la microplaquette. Grâce à la couche (7), la puce peut être implantée dans un corps de carte en restant parfaitement parallèle à ce dernier, ce qui est essentiel pour la réalisation ultérieure des pistes conductrices par sérigraphie.

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