C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
149/24
C09K 13/02 (2006.01) C08J 7/12 (2006.01) C23C 18/22 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1274456
ABSTRACT OF THE DISCLOSURE Aqueous, alkaline liquid NaMnO4 solutions are provided which provide excellent resin desmearing and etchback, especially in the manufacture of printed circuit boards. The solutions comprise water, alkali metal hydroxide, NaMnO4 and from about 0.1 to about 3.0 moles per mole of MnO4- of a co-ion for MnO4- selected from the group consisting of K+, Cs+, Rb+ and mixtures thereof.
504643
Gowling Lafleur Henderson Llp
Mac Dermid Inc.
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