Soft-faced semiconductor component backing

Details Soft-faced semiconductor component backing Soft-faced semiconductor component backing

H - Electricity

01

L

356/110

H01L 23/12 (2006.01) H01L 23/373 (2006.01) H01L 23/40 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1307355

SOFT-FACED SEMICONDUCTOR COMPONENT BACKING ABSTRACT OF THE DISCLOSURE A thermally conductive interface for positionably mounting encapsulated semiconductor devices onto a chassis or other mounting surface. The interface comprises a soft pliable plastic layer of a synthetic resin selected from the group consisting of silicone rubber, epoxy, polyester and polyurethane bonded to a planar surface of the sheath portion of an encapsulated semiconductor device. The pliable layer has a thickness less than about 10 mils and a hardness of between about 10 and 60 durometer.

576364

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