C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/08 (2006.01) B32B 27/32 (2006.01) C08J 5/18 (2006.01) C08L 23/06 (2006.01)
Patent
CA 2144737
The present invention provides for a polymer composition comprising a blend of from 25 to 90 % by weight of a very low density ethylene polymer having a density on the range of from 0.88 to 0.925 g/cm3, a melt index of from 0.5 to 7.5 dg/min, a molecular weight distribution not greater than 3.5 and a compositional distribution breadth index greater than 70 %, and from 10 to 75 % by weight of a low to medium density ethylene polymer having a density of from 0.910 to 0.935, a melt in- dex of from 0.5 to 20 dg/min, a molecular weight distribution greater than 3.5 and a compositional breadth index less than 70 %. The invention also provides for films prepared from this blend having single layer construction or having laminar ABA construction wherein the A or skin layers comprise the blend of this invention and the B or core layer comprises a dif- ferent olefin polymer such as high density polyethylene. Films of this invention exhibit excellent elongation, tensile and im- pact properties and also softness, feel and noise properties which render them eminently suitable for use as back sheet com- ponents in the fabrication of absorbent articles such as diapers, bed pads and like articles where such properties are desirable.
Halle Richard Wayne
Hodgson William John Jr.
Pierce Charles Lillard
Borden Ladner Gervais Llp
Exxon Chemical Patents Inc.
Exxonmobil Chemical Patents Inc.
LandOfFree
Soft films having enhanced physical properties does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Soft films having enhanced physical properties, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soft films having enhanced physical properties will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1998477