Soft plasma ignition in plasma processing chambers

Details Soft plasma ignition in plasma processing chambers Soft plasma ignition in plasma processing chambers

H - Electricity

01

J

H01J 7/36 (2006.01) H01J 7/34 (2006.01) H01J 37/32 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2166549

The specification discloses a power sup- ply circuit (30) which reduces oscillations (26) generated upon ignition of a plasma within a processing chamber (14). A secondary power supply (32) pre-ignites the plasma by driving the cathode (12) to a process initiation voltage. Thereafter, a primary power supply (10) electri- cally drives the cathode (12) to generate plasma current and deposition on a wafer (16).

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