C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 290/06 (2006.01) B41N 1/12 (2006.01) G03F 7/027 (2006.01) G03F 7/028 (2006.01)
Patent
CA 2165015
A photosensitive resin composition includes a urethane oligomer prepared from a hydroxy-functionalized acrylate and/or methacrylate, at least one diol, and 2,4- toluene diisocyanate and 2,6-toluene diisocyanate in a 65:35 weight ratio. The resin composition additionally contains a monomer having at least one acrylate or methacrylate group, and a photoreactive initiator. The photosensitive resin composition may be cured to provide a soft photopolymer printing plate, particularly well suited for printing on corrugated board.
Fetherstonhaugh & Co.
Hercules Incorporated
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