Soil-cutting apparatus and liquid fertilizer injection...

A - Human Necessities – 01 – C

Patent

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Details

A01C 23/02 (2006.01) A01B 5/00 (2006.01) A01B 13/08 (2006.01) A01B 49/06 (2006.01) A01B 79/02 (2006.01)

Patent

CA 2562575

A method is described for cutting sub-surface cavities into a region of soil and for delivering liquid fertilizer directly to each cavity while minimizing overflow or spillage of liquid fertilizer onto the surrounding surface soil. A cutting apparatus is described for creating sub-surface cavities the soil, each cavity is associated with an opening at the soil surface through which liquid fertilizer can be delivered to the cavity. A system for delivery of liquid fertilizer to the cavities is described, which includes a fertilizer dispenser including a metering valve assembly for delivery of liquid fertilizer to each cavity. A synchronization system may be incorporated into the system for locating each cavity and directing the dispensing of liquid fertilizer.

L'invention concerne un procédé qui permet de creuser des cavités souterraines dans une région du sol et qui distribue l'engrais liquide directement dans chaque cavité tout en minimisant le débordement ou le déversement d'engrais liquide sur la surface du sol environnante. L'invention décrit un appareil qui sert à créer des cavités souterraines dans le sol, chaque cavité étant associée à une ouverture située au niveau de la surface du sol, à travers laquelle de l'engrais liquide peut être injecté dans la cavité. L'invention décrit également un système de distribution d'engrais liquide dans les cavités, ce système comprenant un distributeur d'engrais constitué d'un ensemble soupape de dosage permettant de distribuer un engrais liquide dans chaque cavité. Un système de synchronisation peut être compris dans le système afin de localiser chaque cavité et de diriger la distribution de l'engrais liquide.

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