Solder ball placement apparatus

Details Solder ball placement apparatus Solder ball placement apparatus

B - Operations, Transporting

23

K

B23K 3/06 (2006.01) H01L 21/00 (2006.01) H01L 21/48 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2280505

An apparatus for placing an array of solder balls on a substrate (10) includes a carrier plate (18) having an array (80) of holes (82) therethrough. Each hole (82) is capable of holding a solder ball (102). A ball placement head (126) having an array of pins (108) is aligned with a desired pattern (81) of solder balls (102) held by the carrier plate (18). The array of pins (108) push the pattern of solder balls (102) through the holes (82) in the carrier plate (18) onto the substrate (10).

Un appareil de placement d'un groupe de globules de soudure sur un substrat (10), comprend une plaque de support (18) percée d'un réseau (80) d'orifices (82). Chaque orifice (82) est capable de contenir un globule de soudure (102). Une tête de placement de globules (126), présentant une réseau de broches (108), est alignée avec un motif donné (81) de globules de soudure (102), porté par la plaque de support (18). Le réseau de broches (108) pousse le motif de globules de soudure (102) dans les orifices (82) de la plaque de support (18) de sorte qu'ils viennent sur le substrat (10).

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