H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/09 (2006.01) B23K 35/02 (2006.01) B23K 35/34 (2006.01) H05K 1/11 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2063682
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H < W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W > D. A solder layer, obtained by a substitu- tion reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
Fukunaga Takao
Fuse Kenichi
Irie Hisao
Kohno Masanao
Kosuga Izumi
Harima Chemicals Inc.
Ridout & Maybee Llp
The Furukawa Electric Co. Ltd.
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