B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 35/24 (2006.01) B23K 35/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2134632
ABSTRACT: "Solder-coating method, and solder paste suitable for use therein" A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.
de Langen Michael T. W.
Van Gerven Johannes A. H.
Fetherstonhaugh & Co.
Philips Electronics N.v.
LandOfFree
Solder-coating method, and solder paste suitable for use... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder-coating method, and solder paste suitable for use..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder-coating method, and solder paste suitable for use... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1549835