Solder composition

C - Chemistry – Metallurgy – 22 – C

Patent

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C22C 13/00 (2006.01) B23K 35/26 (2006.01) C22C 13/02 (2006.01)

Patent

CA 1308941

ABSTRACT A lead free, cadmium free tin and tin/antimony based solder alloy having a wide melting range for joining copper tubes and brass pipe and fittings. The non-toxic tin based solder composition has a range of 92.5 - 96.9% tin, 3.0 - 5.0% copper, 0.1 - 2.0% nickel and 0.0 - 0.5% silver. The non-toxic tin/antimony based solder composition has a range of 87.0 - 92.9% tin, 4.0 - 6.0% antimony, 3.0 - 5.0% copper, 0.0 - 2.0% nickel and 0.0 - 0.5% silver and is especially suited for plumbing applications having tight and loose fitting solder joints which are exposed to potable water.

571682

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