B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
75/26
B23K 35/26 (2006.01) B23K 35/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 1330168
SOLDER COMPOSITION ABSTRACT OF THE DISCLOSURE A solder composition having a low melting point and a high remelting point sufficient to permit electronic circuit elements to be fixed on a printed circuit board at a low soldering temperature to prevent thermal damage of the electronic circuit elements during the mounting and prevent the elements from droppong off from the board due to any heat applied thereto after soldering. The solder composition includes a low melting solder powder containing a metal additive for melting-point depression, and a reactive alloy powder. The low melting solder powder is melted to form a soldering layer which serves to mount electronic circuit elements on a printed circuit board at a relatively low soldering temperature. At the soldering temperature, the metal additive is reacted with the reactive alloy powder to cause the soldering layer to have a remelting temperature highter than a melting point of the solder composition or solder powder.
554641
Tamashima Atsuzo
Yagi Hiroshi
Fetherstonhaugh & Co.
Tdk Corporation
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