Solder composition

Details Solder composition Solder composition

B - Operations, Transporting

23

K

148/60

B23K 35/24 (2006.01) B23K 35/02 (2006.01) B23K 35/22 (2006.01) H05K 3/34 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1271397

SOLDER COMPOSITION ABSTRACT A solder composition is used to form interconnects between electrical components, such as chip carriers and circuit boards, wherein the solder composition comprises solder paste and disposed in the solder paste a filler which may be particles or filaments which are solid at a temperature at which the solder is molten and are present in an amount and are of sufficient size and density to substantially maintain the solder in a preformed shape when the solder is molten. This filled solder paste can be screen printed on such components and can be layered to form an interconnect with increased height to better withstand thermal expansion stresses.

481365

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