Solder composition

Details Solder composition Solder composition

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 35/30 (2006.01) C22C 28/00 (2006.01)

Patent

CA 2625021

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

La présente invention concerne une composition de brasure comprenant un mélange d'éléments, dont l'étain, l'indium, l'argent et le bismuth, et pouvant inclure environ 30 à 85 % d'étain et environ 15 à 65 % d'indium.

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