Solder delivery system

Details Solder delivery system Solder delivery system

B - Operations, Transporting

23

K

113/87

B23K 3/00 (2006.01) B23K 3/06 (2006.01) B23K 35/02 (2006.01) H01R 4/02 (2006.01) H05K 3/34 (2006.01) H01R 4/72 (2006.01)

Patent

CA 1172109

MP727 ABSTRACT A solder delivery system has a strip of solder material disposed between two polymeric layers, one of the layers being provided with windows to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side containing the windows positioned towards the conductors. On the application of heat the solder melts and flows through the windows towards the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.

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