Solder delivery system

Details Solder delivery system Solder delivery system

B - Operations, Transporting

23

K

26/110, 113/87

B23K 1/00 (2006.01)

Patent

CA 1212588

ABSTRACT OF THE DISCLOSURE A device for electrically connecting electrical con- ductors comprises a layer of polymeric material having one or more windows therein and a quantity of fusible conductive material e.g. solder, preferably in strip form, which will flow through the window or windows when heated, the or each window being capable of gripping a conductor to maintain it is position in the device. Preferably the windows have a narrow portion or neck to enable them to grip the conductors.

417263

Affiliated with

Also associated with

Rating

Solder delivery system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder delivery system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder delivery system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1260516