Solder delivery systems

Details Solder delivery systems Solder delivery systems

H - Electricity

01

L

113/86

H01L 21/58 (2006.01)

Patent

CA 1322898

ABSTRACT OF THE DISCLOSURE Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips3 and rings.

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