H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/373 (2006.01) B23K 35/00 (2006.01) B23K 35/02 (2006.01) B23K 35/26 (2006.01) B32B 15/01 (2006.01) H01L 23/488 (2006.01) H01S 5/02 (2006.01)
Patent
CA 2463645
The solder film manufacturing method has a step for laminating a plurality of unit layers, each unit layer formed by laminating a plurality of layers including layers of only Zn, Bi or Sn, or layers of alloys of two of the metals Zn, Bi and Sn. Thin manufacturing method also preferably also has a step for forming an Sn layer as the top surface layer. A heat sink has a solder film manufactured by this process. A solder junction connects a semiconductor device characterized by having a semiconductor element mounted on this heat sink with a heat sink having this solder elm.
Chiba Yukifumi
Fujii Satoshi
Itakura Katsuhiro
Marks & Clerk
Sumitomo Electric Industries Ltd.
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