Solder flow well for reflowing solder of multipin components

Details Solder flow well for reflowing solder of multipin components Solder flow well for reflowing solder of multipin components

B - Operations, Transporting

23

K

356/22

B23K 3/00 (2006.01) B23K 3/06 (2006.01) H05K 3/34 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1288171

- 8 - ABSTRACT A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed within or adjacent the through hole pattern.

575022

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