H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/485 (2006.01) H01L 21/60 (2006.01) H01L 23/488 (2006.01) H01L 23/50 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2084685
The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier (12) a pad (14) is formed on which a solder mass (16) is deposited and capped with a metal layer (19), thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass (26) on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a side- wall spacer formed on the sidewalls of the solder mass.
Agarwala Birendra N.
Ahsan Aziz M.
Bross Arthur
Chadurjian Mark F.
Koopman Nicholas G.
International Business Machines Corporation
Saunders Raymond H.
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