Solder interconnections and methods for making same

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 23/485 (2006.01) H01L 21/60 (2006.01) H01L 23/488 (2006.01) H01L 23/50 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2084685

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier (12) a pad (14) is formed on which a solder mass (16) is deposited and capped with a metal layer (19), thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass (26) on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a side- wall spacer formed on the sidewalls of the solder mass.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Solder interconnections and methods for making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder interconnections and methods for making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder interconnections and methods for making same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1521916

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.