Solder joint

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H - Electricity

01

L

356/6

H01L 21/60 (2006.01) H01L 21/58 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1261975

SOLDER JOINT Abstract of the Disclosure A power component such as a power transistor is mounted on an insulating substrate of e.g. Beryllia. By using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lands, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimised if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.

545373

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