H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/34 (2006.01) G03F 7/00 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2239031
A permanent solder mask is applied to the surface of a printed circuit board using a copper foil carrier. The solder mask preferably is one or two layers of a thermosetting resin e.g. epoxy resin (26). Selected circuit features are exposed by etching away portions of the copper foil (24) and removing the underlying thermosetting resin. Then, the remaining copper foil (24) is removed, leaving the solder mask on the surface of the printed circuit board.
Un masque de soudure permanent est appliqué à la surface d'une carte à circuits imprimés au moyen d'un substrat en feuille de cuivre. Ce masque comprend de préférence une ou deux couches de résine thermodurcissable (par exemple, résine époxy). On dénude les circuits voulus en attaquant telle ou telle partie de la feuille de cuivre et en éliminant la résine thermodurcissable sous-jacente; on élimine ensuite le reste de la feuille de cuivre, laissant en place le masque de soudure à la surface de la carte à circuits imprimés.
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
LandOfFree
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