Solder mask resins having improved stability

Details Solder mask resins having improved stability Solder mask resins having improved stability

G - Physics

03

F

96/252, 400/4025

G03F 7/027 (2006.01) G03F 7/033 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1334880

Photosensitive resin compositions which can be used to prepare solder masks of improved stability are provided, together with a method of forming a cured, imagewise distribution of the solder mask composition on a printed circuit board substrate. Such composition are radiation curable and comprise a partial ester of a hydroxyalkyl (meth)acrylate and a styrene-maleic anhydride copolymer, a multifunctional (meth)acrylate monomer, a photoinitiator and a multifunctional epoxide.

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