H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/173
H05K 3/30 (2006.01) H01L 23/485 (2006.01) H01L 23/532 (2006.01)
Patent
CA 1165468
Solder Mound Formation On Substrates Abstract A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components. FI9-81-013
395695
Bhattacharya Somnath
Hu Shih-Ming
Koopman Nicholas G.
Oldakowski Chester C.
International Business Machines Corporation
Saunders Raymond H.
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