Solder or conductive paste printing device

Details Solder or conductive paste printing device Solder or conductive paste printing device

B - Operations, Transporting

41

F

B41F 15/36 (2006.01) B41F 27/08 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2072074

2072074 9208616 PCTABS00013 In the device disclosed, the printing plate (4) is clamped in place by means of a tie beam (3) which can be displaced with respect to one side (2) of the frame, this side being fixed. The printing plate (4) is held to the fixed side (2) of the frame or to the tie beam (3) by a multiplicity of bolts (17) distributed along flanges (16) on the fixed side (2) of the frame and the tie beam (3). The new device enables printing plates (4) to be replaced without having to remove the frame (1) from the printing bench or the surface being printed.

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