Solder pack and method of manufacture thereof

Details Solder pack and method of manufacture thereof Solder pack and method of manufacture thereof

B - Operations, Transporting

23

K

113/96

B23K 3/00 (2006.01) B23K 35/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1119894

SOLDER PACK AND METHOD OF MANUFACTURE THEREOF ABSTRACT A solder pack consists of a thin heat resistant carrier board having spaced holes therethrough in which are held solder rings. The solder pack is, for example, placed over pins supported in correspondingly spaced holes in a printed circuit board so that each pin protrudes through an associated solder ring in the solder pack. Heat is applied to melt the solder rings to solder the pins to the printed circuit board. Two representative means for manufacturing solder packs are disclosed.

329068

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